The Study of the Blister on the FPC Connector

• Main Authors: Che-Hao Hsu, 許哲豪
• Other Authors: 周文祥
• Format: Others
• Language: zh-TW
• Published: 2012
• Online Access: http://ndltd.ncl.edu.tw/handle/dyhe63

碩士 === 國立臺北科技大學 === 製造科技研究所 === 100 === This research is talking about the reason and solution of FPC (Flexible Print Circuit) connector’s surface blisters at a defect rate of 1.667%. These blisters occasionally can be found after the connector passes through IR reflow soldering, when soldering between PCB (Printed Circuit Board) and FPC connector. The experiment will be based on the Taguchi method and according to previews literatures and the advising professor’s suggestions it was decided the factors of the experiment to research the reason and solution of the blisters. CAE software-Moldflow is going to be used to find out the effect between the molding condition of FPC connector and the blisters. According to the result of the experiment, the ram speed, melt temperature, mold temperature, and packing pressure are major factors that lead the blisters to appear, being the first three factors directly related to the shear rate. Usually, if the shear rate is too high, the rate of material degrading and generating some gas will be higher. Therefore, we got an optimal condition by lowering the ram speed and the melt temperature, keeping the mold temperature as the same, and increasing the packing pressure, will reduce the 5.67×104 s-1 shear rate and 1.667% defect rate to a lower rate.