Electroless Plating of Manufacturing Composite Pb-free Solder Joint In Ball Grid Array
碩士 === 國立臺北科技大學 === 製造科技研究所 === 100 === In this study, mainly electroless tin plating method to manufacturing Pb-free composite solder, and analyze the mechanical properties of Pb-free composite solder, expected to achieve the purpose of improving the solder ball grid array package mechanical proper...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/x6786x |