HIGH POWER LIGHT EMITTING DIODES PACKAGE TECHNOLOGY AND FOR ANALYSIS HEAT DISSIPATION
碩士 === 國立臺北科技大學 === 機電整合研究所 === 100 === The articles presented herein are the research and study of LEDs sealing package technology improvement, by various medium-elements and related parameters affect the critical working conditions, by high temperature environment caused by high-current conjunctio...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/7xd2qm |