Wafer die recognition and markless human computer interface implementation based on machine vision
碩士 === 國立雲林科技大學 === 電機工程系碩士班 === 100 === This thesis can be divided into two parts. The first part presents a robust method to automatically determine the number of packaged dies in the residual wafer image, in which most dies have been removed and packaged. We propose the die segmentation region de...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/77109377768471083902 |