Bonding of Ceramic Sputtering Target to Metallic Backing Plate with Active Elements Containing Lead-Free Solders
碩士 === 國立雲林科技大學 === 機械工程系碩士班 === 100 === In this study, SnZnBi and SnZnIn lead-free solders could be improved the wettability on the ceramic surface by adding active alloying elements. Four types of Sn-based lead-free solders with melting point below 200℃ have been developed. The active solders were...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/31671666894870616001 |