Bonding of Ceramic Sputtering Target to Metallic Backing Plate with Active Elements Containing Lead-Free Solders
碩士 === 國立雲林科技大學 === 機械工程系碩士班 === 100 === In this study, SnZnBi and SnZnIn lead-free solders could be improved the wettability on the ceramic surface by adding active alloying elements. Four types of Sn-based lead-free solders with melting point below 200℃ have been developed. The active solders were...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2012
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/31671666894870616001 |
| Summary: | 碩士 === 國立雲林科技大學 === 機械工程系碩士班 === 100 === In this study, SnZnBi and SnZnIn lead-free solders could be improved the wettability on the ceramic surface by adding active alloying elements. Four types of Sn-based lead-free solders with melting point below 200℃ have been developed. The active solders were successfully used to join copper backing plate with transparent conductive ceramic target (ITO、ZnO、AZO) and ZnS-SiO2 dielectric ceramic target at 200℃ in air without flux and pre-metallization. Titanium, magnesium and rare earth elements have high chemical activity. The active alloying elements containing lead-free solder was used to promote the wetting of the solder on the difficult to wet sputtering ceramic target surface. The micrographs and interfacial diffusion of the joints were analyzed by scanning electron microscopy (SEM) couple to an energy dispersive X-ray spectrometer (EDS). In order to provide the reliability of the bonding interface of the sputtering target and copper backing plate, the shear testing of the specimens was carried out at room temperature and high temperature. Fracture surface morphology and the cross-sectional analysis with scanning electron microscope were use to establish the joining reaction and fracture.
|
|---|