Bonding of Ceramic Sputtering Target to Metallic Backing Plate with Active Elements Containing Lead-Free Solders
碩士 === 國立雲林科技大學 === 機械工程系碩士班 === 100 === In this study, SnZnBi and SnZnIn lead-free solders could be improved the wettability on the ceramic surface by adding active alloying elements. Four types of Sn-based lead-free solders with melting point below 200℃ have been developed. The active solders were...
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ndltd-TW-100YUNT54890022015-10-13T21:55:44Z http://ndltd.ncl.edu.tw/handle/31671666894870616001 Bonding of Ceramic Sputtering Target to Metallic Backing Plate with Active Elements Containing Lead-Free Solders 具有活性元素之無鉛銲錫應用於陶瓷濺鍍靶材與金屬背板接合之研究 Cheng-kai Li 李成鎧 碩士 國立雲林科技大學 機械工程系碩士班 100 In this study, SnZnBi and SnZnIn lead-free solders could be improved the wettability on the ceramic surface by adding active alloying elements. Four types of Sn-based lead-free solders with melting point below 200℃ have been developed. The active solders were successfully used to join copper backing plate with transparent conductive ceramic target (ITO、ZnO、AZO) and ZnS-SiO2 dielectric ceramic target at 200℃ in air without flux and pre-metallization. Titanium, magnesium and rare earth elements have high chemical activity. The active alloying elements containing lead-free solder was used to promote the wetting of the solder on the difficult to wet sputtering ceramic target surface. The micrographs and interfacial diffusion of the joints were analyzed by scanning electron microscopy (SEM) couple to an energy dispersive X-ray spectrometer (EDS). In order to provide the reliability of the bonding interface of the sputtering target and copper backing plate, the shear testing of the specimens was carried out at room temperature and high temperature. Fracture surface morphology and the cross-sectional analysis with scanning electron microscope were use to establish the joining reaction and fracture. Shih-ying Chang 張世穎 2012 學位論文 ; thesis 130 zh-TW |
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碩士 === 國立雲林科技大學 === 機械工程系碩士班 === 100 === In this study, SnZnBi and SnZnIn lead-free solders could be improved the wettability on the ceramic surface by adding active alloying elements. Four types of Sn-based lead-free solders with melting point below 200℃ have been developed. The active solders were successfully used to join copper backing plate with transparent conductive ceramic target (ITO、ZnO、AZO) and ZnS-SiO2 dielectric ceramic target at 200℃ in air without flux and pre-metallization. Titanium, magnesium and rare earth elements have high chemical activity. The active alloying elements containing lead-free solder was used to promote the wetting of the solder on the difficult to wet sputtering ceramic target surface. The micrographs and interfacial diffusion of the joints were analyzed by scanning electron microscopy (SEM) couple to an energy dispersive X-ray spectrometer (EDS). In order to provide the reliability of the bonding interface of the sputtering target and copper backing plate, the shear testing of the specimens was carried out at room temperature and high temperature. Fracture surface morphology and the cross-sectional analysis with scanning electron microscope were use to establish the joining reaction and fracture.
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author2 |
Shih-ying Chang |
author_facet |
Shih-ying Chang Cheng-kai Li 李成鎧 |
author |
Cheng-kai Li 李成鎧 |
spellingShingle |
Cheng-kai Li 李成鎧 Bonding of Ceramic Sputtering Target to Metallic Backing Plate with Active Elements Containing Lead-Free Solders |
author_sort |
Cheng-kai Li |
title |
Bonding of Ceramic Sputtering Target to Metallic Backing Plate with Active Elements Containing Lead-Free Solders |
title_short |
Bonding of Ceramic Sputtering Target to Metallic Backing Plate with Active Elements Containing Lead-Free Solders |
title_full |
Bonding of Ceramic Sputtering Target to Metallic Backing Plate with Active Elements Containing Lead-Free Solders |
title_fullStr |
Bonding of Ceramic Sputtering Target to Metallic Backing Plate with Active Elements Containing Lead-Free Solders |
title_full_unstemmed |
Bonding of Ceramic Sputtering Target to Metallic Backing Plate with Active Elements Containing Lead-Free Solders |
title_sort |
bonding of ceramic sputtering target to metallic backing plate with active elements containing lead-free solders |
publishDate |
2012 |
url |
http://ndltd.ncl.edu.tw/handle/31671666894870616001 |
work_keys_str_mv |
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