Study on Micro Stress Sensors for Through-Silicon-Via (TSV) Device
碩士 === 國防大學理工學院 === 機械工程碩士班 === 101 === Because of the rapid development of the microelectronics industry, newly developed technologies such as the Through Silicon Via (TSV) for three-dimensional packaging designs became more and more important. Since the TSV components are extremely small, only mi...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/91953496737743871278 |