Mechanical Property Analyses of the High-power Diode Package Structure
碩士 === 國防大學理工學院 === 機械工程碩士班 === 101 === As the trend of the semiconductor components was developed toward smaller and lighter, the thermal and thermo-stress problems on microelectronic packaging increase at the same time. Consequently, stresses are generated between the material in a packaging struc...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/33713079165366719214 |