Mechanical Property Analyses of the High-power Diode Package Structure
碩士 === 國防大學理工學院 === 機械工程碩士班 === 101 === As the trend of the semiconductor components was developed toward smaller and lighter, the thermal and thermo-stress problems on microelectronic packaging increase at the same time. Consequently, stresses are generated between the material in a packaging struc...
Main Authors: | Wu, Pei-Hsuan, 吳珮瑄 |
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Other Authors: | Lwo, Ben-Je |
Format: | Others |
Language: | zh-TW |
Published: |
2013
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Online Access: | http://ndltd.ncl.edu.tw/handle/33713079165366719214 |
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