Analysis of the Electronic Components Performance on Through Silicon Via structure
碩士 === 國防大學理工學院 === 機械工程碩士班 === 101 === In recent years, electronic products towards the target of light, thin, short, small, the size of each component of the package also will be reduced inside the structure. Integrated technology of three-dimensional (3D Integration) is generally be researched. C...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/36083087193073874895 |