A Study on Electromigration in Lead-free Solder Joints-using Electroless Nickel and Electroless Cobalt as Diffusion Barrier
碩士 === 國立中正大學 === 化學工程研究所 === 101 === Electromigration has become a serious reliability issue in flip chip packaging. Therefore, electromigration on interfacial reactions between electroless Ni-P or electroless Co-P and Sn-based solders was studied in this study. The reaction couples are prepared fo...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/70849361453131724165 |