A Novel Method to Improve LED Fail Effect by Bonding a Wire before Double Die Bonds with Silver Pastes
碩士 === 中華大學 === 電機工程學系碩士在職專班 === 101 === LED fail effect is one of the most important problems of reliability. This problem comes from open circuit, leakage and brightness die-out. It happens in the LED package processes, the die bond of silver paste and the encapsulation epoxy molding compound may...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/86fj95 |