Finite Element Model to Solder Ball Life Prediction of PBGA
碩士 === 中華大學 === 機械工程學系碩士在職專班 === 101 === Abstract The trend of electronic products today is moving toward further miniaturization, high functionality and improved performance. To accomplish this, packaging needs to be able to integrate higher I/O counts, smaller...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/mn6843 |