The Application of Lean Six Sigma to Construct Process Quality Control Plan－ Case Study in PCB Solder Mask Process
碩士 === 中原大學 === 工業與系統工程研究所 === 101 === This study aims to probe the characteristics of solder mask in printed circuit board manufacturing, and also by using the lean six sigma (DMAIC) structure approach to develop the processes (Define, Measure, Analyze, Improve, and Control) to perform solder mask...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/47940839993181981028 |