Study of Wire Bonding &; Bonding Finger in Substrate of Semiconductor
碩士 === 逢甲大學 === 工業工程與系統管理學系 === 101 === With the diversification of digital products such as computers and cell phone in recent years, the packaging process of semiconductor has evolved from the traditional technology to the development of high-precision and high-power miniaturized process. Semi-con...
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| Format: | Others |
| Language: | zh-TW |
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2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/63975762490733436657 |