Study of Wire Bonding &; Bonding Finger in Substrate of Semiconductor
碩士 === 逢甲大學 === 工業工程與系統管理學系 === 101 === With the diversification of digital products such as computers and cell phone in recent years, the packaging process of semiconductor has evolved from the traditional technology to the development of high-precision and high-power miniaturized process. Semi-con...
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ndltd-TW-101FCU050310722015-10-13T22:57:03Z http://ndltd.ncl.edu.tw/handle/63975762490733436657 Study of Wire Bonding &; Bonding Finger in Substrate of Semiconductor 半導體銲線與基板中銲線手指設計之研究 薛宇廷 碩士 逢甲大學 工業工程與系統管理學系 101 With the diversification of digital products such as computers and cell phone in recent years, the packaging process of semiconductor has evolved from the traditional technology to the development of high-precision and high-power miniaturized process. Semi-conductor packaging needs to achieve the goal of high reliability, good heat dissipation, and low manufacturing costs. Facing the fluctuation in customer demand and the shortening of life cycle product, cross-cutting and system integration are two important issues. The wire bonding step occupies a pivotal position in the packaging process. Due to the rapid development of the integrated circuit packaging technologies, the traditional wire bonders with low speed, low precision, and low stability, can no longer to meet the demand of the industry. So, using wire bonders with thermal ultrasound functions instead is a trend. The wire bonding design, however, has a close relationship with the UPH of the wire bonder. This issue is also investigated in this study. 陳亭志 2013 學位論文 ; thesis 44 zh-TW |
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碩士 === 逢甲大學 === 工業工程與系統管理學系 === 101 === With the diversification of digital products such as computers and cell phone in recent years, the packaging process of semiconductor has evolved from the traditional technology to the development of high-precision and high-power miniaturized process.
Semi-conductor packaging needs to achieve the goal of high reliability, good heat dissipation, and low manufacturing costs. Facing the fluctuation in customer demand and the shortening of life cycle product, cross-cutting and system integration are two important issues.
The wire bonding step occupies a pivotal position in the packaging process. Due to the rapid development of the integrated circuit packaging technologies, the traditional wire bonders with low speed, low precision, and low stability, can no longer to meet the demand of the industry. So, using wire bonders with thermal ultrasound functions instead is a trend. The wire bonding design, however, has a close relationship with the UPH of the wire bonder. This issue is also investigated in this study.
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陳亭志 |
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陳亭志 薛宇廷 |
author |
薛宇廷 |
spellingShingle |
薛宇廷 Study of Wire Bonding &; Bonding Finger in Substrate of Semiconductor |
author_sort |
薛宇廷 |
title |
Study of Wire Bonding &; Bonding Finger in Substrate of Semiconductor |
title_short |
Study of Wire Bonding &; Bonding Finger in Substrate of Semiconductor |
title_full |
Study of Wire Bonding &; Bonding Finger in Substrate of Semiconductor |
title_fullStr |
Study of Wire Bonding &; Bonding Finger in Substrate of Semiconductor |
title_full_unstemmed |
Study of Wire Bonding &; Bonding Finger in Substrate of Semiconductor |
title_sort |
study of wire bonding &; bonding finger in substrate of semiconductor |
publishDate |
2013 |
url |
http://ndltd.ncl.edu.tw/handle/63975762490733436657 |
work_keys_str_mv |
AT xuēyǔtíng studyofwirebondingbondingfingerinsubstrateofsemiconductor AT xuēyǔtíng bàndǎotǐhànxiànyǔjībǎnzhōnghànxiànshǒuzhǐshèjìzhīyánjiū |
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