Study of Wire Bonding &; Bonding Finger in Substrate of Semiconductor

• Main Author: 薛宇廷
• Other Authors: 陳亭志
• Format: Others
• Language: zh-TW
• Published: 2013
• Online Access: http://ndltd.ncl.edu.tw/handle/63975762490733436657

碩士 === 逢甲大學 === 工業工程與系統管理學系 === 101 === With the diversification of digital products such as computers and cell phone in recent years, the packaging process of semiconductor has evolved from the traditional technology to the development of high-precision and high-power miniaturized process. Semi-conductor packaging needs to achieve the goal of high reliability, good heat dissipation, and low manufacturing costs. Facing the fluctuation in customer demand and the shortening of life cycle product, cross-cutting and system integration are two important issues. The wire bonding step occupies a pivotal position in the packaging process. Due to the rapid development of the integrated circuit packaging technologies, the traditional wire bonders with low speed, low precision, and low stability, can no longer to meet the demand of the industry. So, using wire bonders with thermal ultrasound functions instead is a trend. The wire bonding design, however, has a close relationship with the UPH of the wire bonder. This issue is also investigated in this study.