Improvement of Film Void on the Semiconductor Packaging of a Heat Pressure Cure Machine by Using Taguchi Method
碩士 === 逢甲大學 === 機械與電腦輔助工程學系 === 101 === For memory capacity needs in electronic products and development of integrated circuit package, chip stack package has become a major trend in memory package. In stacked chip technology, DAF (Die Attach Film) is widely used in stacked chips. Therefore, it coul...
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| Format: | Others |
| Language: | zh-TW |
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2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/57158250958566116039 |