Improvement of Film Void on the Semiconductor Packaging of a Heat Pressure Cure Machine by Using Taguchi Method

• Main Author: 張永信
• Other Authors: 林孟儒
• Format: Others
• Language: zh-TW
• Published: 2013
• Online Access: http://ndltd.ncl.edu.tw/handle/57158250958566116039

碩士 === 逢甲大學 === 機械與電腦輔助工程學系 === 101 === For memory capacity needs in electronic products and development of integrated circuit package, chip stack package has become a major trend in memory package. In stacked chip technology, DAF (Die Attach Film) is widely used in stacked chips. Therefore, it could be considered as composite materials. For adhering different chips together, there will be air holes (Film void) produced in thin-films which adhere chips during Die Bond Cure Station of IC packaging processes. This work wants to solve the air holes problem in Die Bond Cure Station process found in traditional oven replaced by using Heat Pressure Cure Machine. And the best baking parameters combination of Heat Pressure Cure Machine is investigated. The parameters include pressure, baking temperature, baking time, etc. Taguchi Method is used to obtain the appropriate parameters to improve product quality. Experimental results verify the parameters obtained in this study can effectively enhance Die Bond Cure Station process quality. Keywords : Heat Pressure Cure Machine、Stacked Chip、DAF、Film Void、Taguchi Method。