A Study of Polishing Pad for Bare Glass of TFT-LCD Applications

• Main Authors: Kun-Cheng Tsai, 蔡坤成
• Other Authors: Tsung-Han Ho
• Format: Others
• Language: zh-TW
• Published: 2013
• Online Access: http://ndltd.ncl.edu.tw/handle/32148079518250545031

碩士 === 國立高雄應用科技大學 === 化學工程系碩士班 === 101 === With the flat plane display(FPD) of a wide range of application, short and light glass become a key technology, and the thinner the glass, chemical mechanical polishing(CMP) is more important. In order to increase the removal rate of the glass, often added abrasive powder into the polishing pad. Because different particle size of the abrasive powder into the polishing pad, the dispersion uniformity of the polishing powder, may causing the variation of the stability on the structure of the polishing pad. In addition,how to design the groove on the polishing pad surface to achieve optimized removal rate is very important thing. This paper mainly discusses the three parts. The first part is to discuss the influence of different particle sizes of abrasive powder added to the polishing on the physical properties and dispersion uniformity. The second part is to discuss the adhesion strength after the polishing, under the different environments(temperature, pH value). The third part is to discuss the different grooves of the polishing pad on the glass removal rate. According to the experimental results, when adding the abrasive powder particle size <1.30μm will be apparent dispersion uneven, but particle size of 1.56μm can improve dispersion uniformity and resolve clogging of the circulation. The physical properties of polishing pad are mainly affected by the temperature and are independent of the size of adding particle. When ditching rate is 20.0%, it has the highest removal rate (6.25μm/30min), and excellent uniformity (2μm) , and the lowest polishing temperature.