| Summary: | 碩士 === 明新科技大學 === 化學工程與材料科技研究所 === 101 === Strongly alkaline tetramethylammonium hydroxide (TMAH) solution is typically used in the semiconductor manufacturing process dry or liquid-type photosensitive resist removal. Removal of the photoresist when tetramethylammonium hydroxide stripper was raised to 80°C to 90℃. The solution contact bump copper and copper metal corrosion caused. In this study, in order to cause copper corrosion defects tetramethylammonium hydroxide. Explore the process temperature of copper metal corrosion defects. Tetramethylammonium hydroxide degradated to be trimethylamine causes corrosion of copper film. Etching will cause the side etching is too large. The GC instrument analysis of its trimethylamine. From the experimental results, this study demonstrated a tetramethylammonium hydroxide stripper pyrolysis trimethylamine, trimethylamine will cause corrosion of the copper metal, causing the side etching is too large defects.
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