A study on that tetramethylammonium hydroxide degradated to be trimethylamine causes corrosion of copper film
碩士 === 明新科技大學 === 化學工程與材料科技研究所 === 101 === Strongly alkaline tetramethylammonium hydroxide (TMAH) solution is typically used in the semiconductor manufacturing process dry or liquid-type photosensitive resist removal. Removal of the photoresist when tetramethylammonium hydroxide stripper was raised...
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ndltd-TW-101MHIT00630032016-05-22T04:32:50Z http://ndltd.ncl.edu.tw/handle/30786750529558992373 A study on that tetramethylammonium hydroxide degradated to be trimethylamine causes corrosion of copper film 去光阻液中氫氧化四甲基銨裂解為三甲胺造成腐蝕銅薄膜之探討 Su O Lin 林素娥 碩士 明新科技大學 化學工程與材料科技研究所 101 Strongly alkaline tetramethylammonium hydroxide (TMAH) solution is typically used in the semiconductor manufacturing process dry or liquid-type photosensitive resist removal. Removal of the photoresist when tetramethylammonium hydroxide stripper was raised to 80°C to 90℃. The solution contact bump copper and copper metal corrosion caused. In this study, in order to cause copper corrosion defects tetramethylammonium hydroxide. Explore the process temperature of copper metal corrosion defects. Tetramethylammonium hydroxide degradated to be trimethylamine causes corrosion of copper film. Etching will cause the side etching is too large. The GC instrument analysis of its trimethylamine. From the experimental results, this study demonstrated a tetramethylammonium hydroxide stripper pyrolysis trimethylamine, trimethylamine will cause corrosion of the copper metal, causing the side etching is too large defects. Jui-Tang Chen 陳瑞堂 2013 學位論文 ; thesis 60 zh-TW |
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碩士 === 明新科技大學 === 化學工程與材料科技研究所 === 101 === Strongly alkaline tetramethylammonium hydroxide (TMAH) solution is typically used in the semiconductor manufacturing process dry or liquid-type photosensitive resist removal. Removal of the photoresist when tetramethylammonium hydroxide stripper was raised to 80°C to 90℃. The solution contact bump copper and copper metal corrosion caused. In this study, in order to cause copper corrosion defects tetramethylammonium hydroxide. Explore the process temperature of copper metal corrosion defects. Tetramethylammonium hydroxide degradated to be trimethylamine causes corrosion of copper film. Etching will cause the side etching is too large. The GC instrument analysis of its trimethylamine. From the experimental results, this study demonstrated a tetramethylammonium hydroxide stripper pyrolysis trimethylamine, trimethylamine will cause corrosion of the copper metal, causing the side etching is too large defects.
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author2 |
Jui-Tang Chen |
author_facet |
Jui-Tang Chen Su O Lin 林素娥 |
author |
Su O Lin 林素娥 |
spellingShingle |
Su O Lin 林素娥 A study on that tetramethylammonium hydroxide degradated to be trimethylamine causes corrosion of copper film |
author_sort |
Su O Lin |
title |
A study on that tetramethylammonium hydroxide degradated to be trimethylamine causes corrosion of copper film |
title_short |
A study on that tetramethylammonium hydroxide degradated to be trimethylamine causes corrosion of copper film |
title_full |
A study on that tetramethylammonium hydroxide degradated to be trimethylamine causes corrosion of copper film |
title_fullStr |
A study on that tetramethylammonium hydroxide degradated to be trimethylamine causes corrosion of copper film |
title_full_unstemmed |
A study on that tetramethylammonium hydroxide degradated to be trimethylamine causes corrosion of copper film |
title_sort |
study on that tetramethylammonium hydroxide degradated to be trimethylamine causes corrosion of copper film |
publishDate |
2013 |
url |
http://ndltd.ncl.edu.tw/handle/30786750529558992373 |
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