Interfacial Reactions Between Pure Tin and Electroplated Copper Substrates Fabricated Using Different Formulas
碩士 === 國立中興大學 === 化學工程學系所 === 101 === The trend of electronic products development is toward lighter, thinner, smaller, multi-fuctional, and lower cost with advanced technology. When the volume continuously shrinks, the solder joints in electronic products must have better reliability. In recent yea...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/10702759223530357137 |