Periodic Pulse Reverse Cu Electroplating for Through Hole Filling
碩士 === 國立中興大學 === 化學工程學系所 === 101 === In the global consumer electronics industry, high- density interconnection (HDI) is a key for increasing the circuit density in order to meet the marketing requirements of volume shrinkage and multi-function. Besides, three-dimensional (3D) IC chip packaging bec...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/395br5 |