Formula Development for Through-Hole Filling by Copper Electroplating
碩士 === 國立中興大學 === 化學工程學系所 === 101 === In modern life, people are using electronic products that are light, thin, short, small, multifunctional and communication-rapid. To achieve this goal, electronic devices that have narrow line widths and high density interconnect (HDI) are being vigorously deve...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/eq45q9 |