Electroplating of Cu(Re) Alloy Film for Self Formation of Re Diffusion Barrier
碩士 === 國立中興大學 === 材料科學與工程學系所 === 101 === As the scale of copper interconnect structures continually decreases, to form an effective diffusion barrier layer, of only several nanometers thick, with high thermal stability and low electrical resistivity is a very important issue at the current stage of...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/36511441566351916888 |