The Influence of Etch Parameters on Silicon Shallow Trench profile

碩士 === 國立中興大學 === 材料科學與工程學系所 === 101 === Due to the demand of large data processing, the low power consumption, high process speed and high capacitor of memory are increasing drastically. For this purpose, it is necessary to shrink the chip size of dynamic random access memory (DRAM) and improve th...

Full description

Bibliographic Details
Main Authors: Wei-Ling Tang, 唐維翎
Other Authors: 顏秀崗
Format: Others
Language:zh-TW
Published: 2013
Online Access:http://ndltd.ncl.edu.tw/handle/36352918218859481124