Study on the Electrode Voltage to the Wafer-center Deviation During Wafer Release in an Electrostatic Chuck (ESC)

碩士 === 國立中興大學 === 電機工程學系所 === 101 === Among the wafer fabricate processing, while wafer enter process chamber, the wafer need fixed to the holder in chamber then begin to process. However, the normal Mechanical Chuck had problems of wafer edge losses and deformation of the wafer surface, after tha...

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Bibliographic Details
Main Authors: Wei-Min Chen, 陳韋閔
Other Authors: Zingway Pei
Format: Others
Language:zh-TW
Published: 2013
Online Access:http://ndltd.ncl.edu.tw/handle/73994983839499379614