Temperature Dependent Micromechanical Testing on the Formation of Cu/Sn Intermetallic Thin Films
碩士 === 國立中興大學 === 精密工程學系所 === 101 === A temperature controlled tensile testing was performed to investigate the influence of external stress on the growth of an interfacial Cu-Sn IMC layer. The test specimens were prepared by depositing 25 μm layers of tin atop of copper substrate using electroplati...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/a8428s |