Effects of Oxidation and Coating on EMC Mold Adhesion Force
碩士 === 國立成功大學 === 工程科學系碩博士班 === 101 === Potting compound plays a crucial role in maintaining the stability of chip while packaging the electronic integrated circuit (IC). During the process of curing, the phenomenon of Epoxy Molding Compound (EMC) adhering to the surface of packaging molds is called...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/25114664962127037001 |