Molded Underfill for Flip Chip Package
碩士 === 國立成功大學 === 工程科學系碩博士班 === 101 === Air trap in a molded underfill package always exists. It is an annoying problem and needed further investigation. In this research, the mold filling phenomenon of molded underfill (MUF) was investigated through numerical method. The carrier was a flip chip BGA...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/54872767669755939896 |