Interval Optimal Design of 3D Stacking Chip TSV Package Reliability by Using Genetic Algorithm Method
碩士 === 國立成功大學 === 工程科學系碩博士班 === 101 === As consumers’ higher requirement on weight, volume, functionality and power consumption, the Electronic Packaging has been developed towards 3D SIP(System In Package) to ensure the package for accommodating more chips and components in a limited volume. As a...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/69046238647106684033 |