Thermomechanical Reliability Analysis for Wafer Level Chip Scale Packages (WLCSP)
碩士 === 國立成功大學 === 工程科學系專班 === 101 === In this research, the redistribution (RDL) typed wafer level chip scale packages (WLCSP) with and without under bump metallurgy (UBM) layers are evaluated by reliability test and finite element simulation analysis. The most commonly used reliability test method...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/73349913571079197857 |