Wire bonding characteristics of 0.7mil Au-Pd-plated Cu wires
碩士 === 國立成功大學 === 工程科學系碩博士班 === 101 === In semiconductor packaging industry, the wire bonding technology has been developed for a long time. Since the equipment and technology are more mature than the others, wire bonding technology is still the mainstream for packaging technology. For the material...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/75255799222694720740 |