Effects of Ga addition upon Sn-58Bi/ Cu Interfacial reactions
碩士 === 國立成功大學 === 材料科學及工程學系碩博士班 === 101 === ABSTRACT Sn58Bi-xGa alloys are potential candidates to use as a low melting temperature lead free solders. The interfacial reactions between Sn58Bi-xGa (x = 0.25, 0.5, 1.0, 2.0, 3.0 wt. %) molten solders and Cu substrate...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/03540053065025694913 |