The Interfacial Reactions on Pd/Au-coated and Pd-alloyed Cu wire bonds under reliability tests
碩士 === 國立成功大學 === 材料科學及工程學系碩博士班 === 101 === In this study, we investigated the effect of Pd distribution on the interfacial reactions for copper wire bonding under reliability tests utilizing SEM and EPMA. From the results of HTST, we can find that the growth rate of IMCs of Pd-alloyed copper wire b...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/03960655816078923104 |