Enhanced barrier properties and thermal stability of the seedless barrier for sub-30nm metallization application
博士 === 國立成功大學 === 電機工程學系碩博士班 === 101 === As the minimum feature size of microelectronic devices shrinks down to 32 nm and beyond, an increase in the resistivity of metal lines and the bad step coverage with feature shrinkage will be one of the semiconductor manufacturing challenges. In the first...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/67328096012169734188 |