Investigation of Mold Adhesion Phenomenon during the Injection Molding Process
博士 === 國立成功大學 === 機械工程學系碩博士班 === 101 === Serious adhesion can occur not only during IC encapsulation, but also in the injection molding process. However, while many studies have focused on adhesion during the former, much less attention has been paid to the latter. This study thus developed both e...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/75744061429391586697 |