Analysis, Simulation, and Experimental Studies on Stress Behavior of PECVD Multi-Layer Structures after Thermal Cycling

碩士 === 國立成功大學 === 機械工程學系碩博士班 === 101 === Plasma-enhanced chemical vapor deposited (PECVD) dielectric films such as silicon nitride and silicon oxide have been widely used for passivation and inter-metal dielectrics. Multi-layer structures constructed by nitride and oxide films have been shown to hav...

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Bibliographic Details
Main Authors: Yin-KengTsai, 蔡印耕
Other Authors: Kuo-Shen Chen
Format: Others
Language:zh-TW
Published: 2013
Online Access:http://ndltd.ncl.edu.tw/handle/83861846128061987858