Structural Optimization for Wafer Level Package by Using Artificial Neural Network and Genetic Algorithm
碩士 === 國立成功大學 === 機械工程學系碩博士班 === 101 === Wafer level package (WLP) has advantages such as smaller size, higher electrical performance and lower fabrication cost compared to conventional wirebond package, and is widely used in portable electronic applications. Because of the thermal expansion misma...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/22121057545718084924 |