Study of Thermomigration of Cu and Ni in Molten SnAg Microbumps
碩士 === 國立交通大學 === 材料科學與工程學系 === 101 === Microbumps are adapted as the interconnect between chips in 3D-IC packaging. With the interconnect shrinks to micrometer scale, the cross interactions across the two ends of the microbump may become an important issue, since the bump height is below 20μm S...
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| Format: | Others |
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2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/81577696575995522116 |