Effect of Solder Thickness on Electromigration on Sn2.3Ag Solder Joints
碩士 === 國立交通大學 === 材料科學與工程學系 === 101 === As the solder bump size becomes smaller, electromigration failure is a critical reliability issue. As 3D-IC will become an important packaging technology for high performance devices, the bump height will decrease below 10 micron. In this research, the effect...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/68702046852040420951 |