| Summary: | 碩士 === 國立交通大學 === 材料科學與工程學系 === 101 === As the solder bump size becomes smaller, electromigration failure is a critical reliability issue. As 3D-IC will become an important packaging technology for high performance devices, the bump height will decrease below 10 micron. In this research, the effect of different solder thickness on electromigration failure mode is investigated. The solder joint consists four types thickness Sn2.3Ag solder joint, there are 18 μm, 10μm, IMCs (Intermetallic compounds)started bridging and whole solders become IMC. Solder joint with 3 μm electrical Ni/50 μm copper column on the chip side and 27 μm copper trace on the substrate side. The current density was about 2.5× 104 A/cm2 and 3× 104 A/cm2and the testing temperature at 100°C. The result indicates that void was easily observed in solder joints with higher solder thickness, and electromigration failure time was shorter than the joints with lower bump height solders.
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