Interface morphologies and electrical properties of bonded Ge/Si wafers
碩士 === 國立交通大學 === 材料科學與工程學系所 === 101 === Silicon and Germanium integrated for applications in optical communication systems and interconnection have attracted much attention. The formation of a heterojunction between hybrid materials by wafer bonding technique has been generally successful. During h...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/06230961287785022027 |