Interfacial morphologies and electrical properties of wafer bonded p-Ge/n-Si

碩士 === 國立交通大學 === 材料科學與工程學系所 === 101 === Over the past ten years, Si/Ge heterojunction made by direct wafer bonding technology is getting more attention in electronic, optical and micro mechanical industries. Improvements in device characteristics are found in photovoltaic, photodetector, LED an...

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Bibliographic Details
Main Authors: Lin, Ching-Fu, 林敬富
Other Authors: Wu, Yew-Chung
Format: Others
Language:zh-TW
Published: 2013
Online Access:http://ndltd.ncl.edu.tw/handle/56311613597793705412