Massive spalling and morphological change of intermetallic compound affected by adding Pd in Co-based surface finishes

碩士 === 國立中央大學 === 化學工程與材料工程學系 === 101 === This study investigates the interfacial reactions and microstructures of SAC305 solders on four different Co-based surface finishes, electroless Co(W,P) (EC), electroless Co(W,P)/immersion Au (ECIG), electroless Co(W,P)/electroless Pd (ECEP), and electroless...

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Bibliographic Details
Main Authors: Jia-hong Hong, 洪嘉宏
Other Authors: Albert T. Wu
Format: Others
Language:zh-TW
Published: 2013
Online Access:http://ndltd.ncl.edu.tw/handle/03035514280797202045