Test Integration and Yield-Enhancement Techniques for 3-D ICs
碩士 === 國立中央大學 === 電機工程學系 === 101 === Three-dimensional (3-D) integration technology using through-silicon via (TSV) is one emerging integrated circuit (IC) technology. The 3-D integration technology offers many advantages over the 2-D integration technology, such as power reduction, performance impr...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/365nt7 |