The study of monocrystalline silicon electrochemical discharge drilling and coaxial electroplating.
碩士 === 國立中央大學 === 機械工程學系 === 101 === We propose a new way that combined micro chemical electro discharge machining and plating on silicon wafer which can machining a hollow plating layer. In tradition micro hole machining on Si wafer , there are almost using the strong acid or alkali, which is harm...
Main Authors: | , |
---|---|
Other Authors: | |
Format: | Others |
Language: | zh-TW |
Published: |
2013
|
Online Access: | http://ndltd.ncl.edu.tw/handle/91527022564271729202 |