The study of monocrystalline silicon electrochemical discharge drilling and coaxial electroplating.
碩士 === 國立中央大學 === 機械工程學系 === 101 === We propose a new way that combined micro chemical electro discharge machining and plating on silicon wafer which can machining a hollow plating layer. In tradition micro hole machining on Si wafer , there are almost using the strong acid or alkali, which is harm...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/91527022564271729202 |