Studies on the Grinding Characteristics of Diamond Film and SiC using Composite Electro-Plating and Electrolyzing In-process Sharpening Methods.
碩士 === 國立中山大學 === 機械與機電工程學系研究所 === 101 === The Composite electro-plating in-process sharpening (CEPIS) method is employed to sharpen the grinder during the grinding process. However, the coating thickness using CEPIS method is always increasing. To overcome this disadvantage, the pluse reverse curre...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/06738242005301235296 |