Operational parameter control in the fabrication of Sn-Ag-Cu/Ni joint and the effect of nanotwinned Ni film on the interfacial reaction
碩士 === 國立清華大學 === 材料科學工程學系 === 101 === In electronic packaging, rapid growth of intermetallic compound (IMC), fast consumption rate of UBM, dual-phase IMC and spalling phenomenon are concerned in the Sn-Ag-Cu (SAC) solder system. Many studies have aimed to improve the characteristics of the SAC sold...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/95174597645158600704 |